BOM
购物车| 图片 | 型号 | 库存 | 数量 | 数据表 | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
TDU03DTONCONN SOCKET TRANSIST 3POS GOLD |
893 |
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Datasheet |
Tray | - | Active | Transistor | 3 (Rectangular) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Board Guide | Solder | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
TDU03DTODCONN SOCKET TRANSIST 3POS GOLD |
110 |
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Datasheet |
Tray | - | Active | Transistor | 3 (Rectangular) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Board Guide, Flange | Solder | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
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|
MPP-1100-05-DS-4GR(S1402)CONN TRANSIST TO-220/TO-247 5POS |
2906 |
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Datasheet |
Tray | - | Active | Transistor, TO-220 and TO-247 | 5 (Rectangular) | - | Gold | 30.0µin (0.76µm) | Nickel Boron | Through Hole, Right Angle | - | Solder | - | Gold | 30.0µin (0.76µm) | Nickel Boron | Polyphenylene Sulfide (PPS) |
|
FMC05DRTN-S1682CONN TRANSIST TO-220/TO-247 5POS |
2681 |
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Datasheet |
Tray | - | Active | Transistor, TO-220 and TO-247 | 5 (Rectangular) | - | Gold | 30.0µin (0.76µm) | Nickel Boron | Through Hole | - | Solder | - | Gold | 30.0µin (0.76µm) | Nickel Boron | Polyphenylene Sulfide (PPS) |
|
TCC05DCSN-S1403CONN TRANSIST TO-220/TO-247 5POS |
3473 |
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Datasheet |
Tray | - | Active | Transistor, TO-220 and TO-247 | 5 (Rectangular) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Solder | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
TCC03DKSN-S1713CONN TRANSIST TO-262 3POS GOLD |
2897 |
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Datasheet |
Tray | - | Active | Transistor, TO-262 | 3 (Rectangular) | 0.150 (3.81mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Solder | 0.150 (3.81mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
TMJ03DKSD-S1512CONN TRANSIST TO-254 3POS GOLD |
2719 |
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Datasheet |
Tray | - | Active | Transistor, TO-254 | 3 (Rectangular) | 0.150 (3.81mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Flange | Solder | 0.150 (3.81mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
ASU02DXTBCONN SOCKET AXIAL 2POS GOLD |
3688 |
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Datasheet |
Tray | - | Obsolete | Axial | 2 (Rectangular) | - | Gold | 10.0µin (0.25µm) | - | Through Hole | Board Guide | Solder | - | Gold | 10.0µin (0.25µm) | - | - |
|
TDU02DXTBTEST SOCKET |
3464 |
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Datasheet |
Bulk | - | Active | Axial | 2 (Rectangular) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Board Guide | Solder | 0.150 (3.81mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
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